TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama’s 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.
INDICATIONS
Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair
Features:
- Reduced post-operative sensitivity
- Perfect cavity sealing
- Less technique sensitivity
- Prolonged working time
- Fluoride releasing
- Outstanding adhesion performance
- Dependable marginal integrity (Minimized micro-leakage)
- Packaging:
-
- EE-BOND Bottle / 5mL
- Applicator x 25
- Dispensing well
- TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
- Syringe Tip x 10
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